XC6201P382MHCeramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 39pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-1%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1206; Termination: 100% Tin (Sn); Body Dimensions: 0.125" x 0.062" x 0.051"; Container: Bag; Features: MIL-PRF-55681: M Failure Rate
XC6201P382PBCeramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 39pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-1%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1206; Termination: Sn60 Coated; Body Dimensions: 0.125" x 0.062" x 0.051"; Container: Bag; Features: MIL-PRF-55681: P Failure Rate
XC6201P382PLCeramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 39pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-1%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 1206; Termination: Solder Coated (Sn/Pb, 70/30); Body Dimensions: 0.125" x 0.062" x 0.051"; Container: Bag; Features: MIL-PRF-55681: P Failure Rate