K8S64158TM-TE9C

型号:K8S64158TM-TE9C

厂商:Samsung

批号:18+

封装:BGA

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K971 85.05 mm2, COPPER ALLOY, TIN FINISH, RING TERMINAL
K972 85.05 mm2, COPPER ALLOY, TIN FINISH, RING TERMINAL
K973 85.05 mm2, COPPER ALLOY, TIN FINISH, RING TERMINAL
K9E2G08U0M-YIB00 256M X 8 FLASH 2.7V PROM, 30 ns, PDSO48
KA HERMAPHRODITIC, RIGHT ANGLE; STRAIGHT TWO PART BOARD CONNECTOR, CRIMP; SOLDER; WIRE WRAP, PLUG; RECEPTACLE
KA004-79M PGA4, IC SOCKET
KA004-79T PGA4, IC SOCKET
KA004-80G PGA4, IC SOCKET
KA004-80M PGA4, IC SOCKET
KA004-80T PGA4, IC SOCKET
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  • K8S64158TM-TE9C
  • 40000
  • Samsung
  • 18+
  • BGA
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