K8D6316UBM-YI08

型号:K8D6316UBM-YI08

厂商:SAMSUNG

批号:18+

封装:TSOP

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K8S1215EZC-SC1C0 32M X 16 FLASH 1.8V PROM, 100 ns, PBGA64
K8S5515ETC-SC1E0 16M X 16 FLASH 1.8V PROM, 100 ns, PBGA44
K971 85.05 mm2, COPPER ALLOY, TIN FINISH, RING TERMINAL
K972 85.05 mm2, COPPER ALLOY, TIN FINISH, RING TERMINAL
K973 85.05 mm2, COPPER ALLOY, TIN FINISH, RING TERMINAL
K9E2G08U0M-YIB00 256M X 8 FLASH 2.7V PROM, 30 ns, PDSO48
KA HERMAPHRODITIC, RIGHT ANGLE; STRAIGHT TWO PART BOARD CONNECTOR, CRIMP; SOLDER; WIRE WRAP, PLUG; RECEPTACLE
KA004-79M PGA4, IC SOCKET
KA004-79T PGA4, IC SOCKET
KA004-80G PGA4, IC SOCKET
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  • K8D6316UBM-YI08
  • 15200
  • SAMSUNG
  • 18+
  • TSOP
  • 只做原装,只有原装,必须原装 
  • 立即询价
  • K8D6316UBM-YI08
  • 32500
  • SAMSUNG
  • 16+
  • TSOP
  • 进口原装现货,一级代理商 
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  • K8D6316UBM-YI08
  • 40000
  • 代理现货,可申请特价!
  • 18+
  • NA
  • 代理现货,可申请特价! 
  • 立即询价
  • K8D6316UBM-YI08
  • 3000
  • SAMSUNG
  • 16+
  • TSOP
  • 全新原装欢迎询价 
  • 立即询价
  • K8D6316UBM-YI08
  • 5750
  • SAMSUNG
  • 最新年份
  • TSOP
  • 原厂原装现货,假一倍十,特价热销! 
  • 立即询价
  • K8D6316UBM-YI08
  • 15200
  • SAMSUNG
  • 16+
  • TSOP
  • 原装正品,欢迎订购 
  • 立即询价