K8D1616UBM-TI09

型号:K8D1616UBM-TI09

厂商:SAMSUNG/三星

批号:21+

封装:TSOP

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K8S1215EZC-SC1C0 32M X 16 FLASH 1.8V PROM, 100 ns, PBGA64
K8S5515ETC-SC1E0 16M X 16 FLASH 1.8V PROM, 100 ns, PBGA44
K971 85.05 mm2, COPPER ALLOY, TIN FINISH, RING TERMINAL
K972 85.05 mm2, COPPER ALLOY, TIN FINISH, RING TERMINAL
K973 85.05 mm2, COPPER ALLOY, TIN FINISH, RING TERMINAL
K9E2G08U0M-YIB00 256M X 8 FLASH 2.7V PROM, 30 ns, PDSO48
KA HERMAPHRODITIC, RIGHT ANGLE; STRAIGHT TWO PART BOARD CONNECTOR, CRIMP; SOLDER; WIRE WRAP, PLUG; RECEPTACLE
KA004-79M PGA4, IC SOCKET
KA004-79T PGA4, IC SOCKET
KA004-80G PGA4, IC SOCKET
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  • SAMSUNG
  • 16+
  • TSOP
  • ★一级代理★原厂原装现货★免费技术支持★ 
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  • K8D1616UBM-TI09
  • 38680
  • SAMSUNG
  • 22+
  • TSOP
  • 代理渠道,原装正品,假一赔十。 
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  • K8D1616UBM-TI09
  • 8565000
  • SAMSUNG
  • 18+
  • TSOP
  • 代理渠道,原装公司现货 
  • 立即询价
  • K8D1616UBM-TI09
  • 38680
  • SAMSUNG
  • 2018+
  • TSOP
  • 代理渠道,原装正品,假一赔十。 
  • 立即询价