- K3UH9H90MM-AGCJ
- 2449
- SAMSUNG
- 2309+
- DIP-8
- 现货分销 自有库存 正品保障 假一罚十
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- K3UH9H90MM-AGCJ 存储IC
- 20000
- SAMSUNG/三星
- 23+
- BGA
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K3UH9H90MM-AGCJ
型号：K3UH9H90MM-AGCJ
厂商：SAMSUNG/三星
批号：22+
封装：BGA
PDF下载
K4-0.006-AC-124
THERMAL PAD MULTI W/ADH .006" K4
K4-0.006-AC-54
THERMAL PAD TO-220 .006" K4
K4-06
THERMAL PAD 0.006" K4
K40B
COPPER; STEEL, FEMALE; MALE, CIRCULAR CONNECTOR, RECEPTACLE
K40F
COPPER; STEEL, FEMALE; MALE, CIRCULAR CONNECTOR, RECEPTACLE
K40S
COPPER; STEEL, FEMALE; MALE, CIRCULAR CONNECTOR, RECEPTACLE
K4-14R-W
22 mm2, COPPER ALLOY, RING TERMINAL
K41B
COPPER; STEEL, FEMALE; MALE, CIRCULAR CONNECTOR, RECEPTACLE
K41F
COPPER; STEEL, FEMALE; MALE, CIRCULAR CONNECTOR, RECEPTACLE
K41S
COPPER; STEEL, FEMALE; MALE, CIRCULAR CONNECTOR, RECEPTACLE
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