K3UH5H50MM-AGCJ

型号:K3UH5H50MM-AGCJ

厂商:SAMSUNG/三星

批号:21+原厂授权

封装:FBGA556

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K4-0.006-AC-124 THERMAL PAD MULTI W/ADH .006" K4
K4-0.006-AC-54 THERMAL PAD TO-220 .006" K4
K4-06 THERMAL PAD 0.006" K4
K40B COPPER; STEEL, FEMALE; MALE, CIRCULAR CONNECTOR, RECEPTACLE
K40F COPPER; STEEL, FEMALE; MALE, CIRCULAR CONNECTOR, RECEPTACLE
K40S COPPER; STEEL, FEMALE; MALE, CIRCULAR CONNECTOR, RECEPTACLE
K4-14R-W 22 mm2, COPPER ALLOY, RING TERMINAL
K41B COPPER; STEEL, FEMALE; MALE, CIRCULAR CONNECTOR, RECEPTACLE
K41F COPPER; STEEL, FEMALE; MALE, CIRCULAR CONNECTOR, RECEPTACLE
K41S COPPER; STEEL, FEMALE; MALE, CIRCULAR CONNECTOR, RECEPTACLE
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QQ
  • K3UH5H50MM-AGCJ 现货
  • 20000
  • 2017+
  • SAMSUNG
  • BGA
  • 专营三星全系列,原装现货 
  • 立即询价
  • K3UH5H50MM-AGCJ
  • 20000
  • SAMSUNG/三星
  • 23+
  • BGA
  • 原装正品 欢迎咨询 
  • 立即询价
  • K3UH5H50MM-AGCJ 存储IC
  • 83
  • SAMSUNG/三星
  • 17+
  • FBGA556
  • 原装正品现货 
  • 立即询价
  • K3UH5H50MM-AGCJ
  • 9000
  • -
  • 22+
  • -
  • 远创高一级代理,原厂正品渠道可追溯! 
  • 立即询价
  • K3UH5H50MM-AGCJ
  • 8650
  • SAMSUNG/三星
  • 18+
  • FBGA556
  • 保证100%原装正品,价格优势假一赔十,可开票 
  • 立即询价