K3QF2F20DB-HGCE

型号:K3QF2F20DB-HGCE

厂商:SAMSUNG/三星

批号:14+

封装:BGA

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K4-0.006-AC-124 THERMAL PAD MULTI W/ADH .006" K4
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K40B COPPER; STEEL, FEMALE; MALE, CIRCULAR CONNECTOR, RECEPTACLE
K40F COPPER; STEEL, FEMALE; MALE, CIRCULAR CONNECTOR, RECEPTACLE
K40S COPPER; STEEL, FEMALE; MALE, CIRCULAR CONNECTOR, RECEPTACLE
K4-14R-W 22 mm2, COPPER ALLOY, RING TERMINAL
K41B COPPER; STEEL, FEMALE; MALE, CIRCULAR CONNECTOR, RECEPTACLE
K41F COPPER; STEEL, FEMALE; MALE, CIRCULAR CONNECTOR, RECEPTACLE
K41S COPPER; STEEL, FEMALE; MALE, CIRCULAR CONNECTOR, RECEPTACLE
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QQ
  • K3QF2F20DB-HGCE
  • 60
  • SAMSUNG/三星
  • 14+
  • BGA
  • 只做原装正品 
  • 立即询价
  • K3QF2F20DB-HGCE
  • 5060
  • SAMSUNG/三星
  • 21+
  • BGA
  • 原厂原装,代理渠道,可开发票 
  • 立即询价
  • K3QF2F20DB-HGCE
  • 26300
  • SAMSUNG/三星
  • 19+
  • BGA
  • 绝对原装进口现货,只做原装正品! 
  • 立即询价
  • K3QF2F20DB-HGCE
  • 88960
  • SAMSUNG/三星
  • 22+
  • BGA
  • 代理渠道,原装正品,假一赔十。 
  • 立即询价