BU6302K
型号:BU6302K
厂商:原厂
批号:13+
封装:QFP-64
PDF下载
BU-63149D3-202W
Surface Mount Feet: SOIC; Bottom Package Code: SOJ26A; Top Pitch (mm): 1.27; Bottom Pitch (mm): 1.27; Top Pin Count: 26; Bottom Pin Count: 26; Top Interface: MGA Male pins; Bottom Interface: J-leaded; IC Package Lead Tip to Tip (mm): 6.8; Compatible Part 1: SK-MGA13/26A-01; SOIC Body Width (mm): 7.62; SOIC Body Length (mm): 7.62; Part Description: SOJ SMT Foot;
相关PDF
相关代理商